ASML’s chip packaging move threatens Besi shares, Bank of America says
Besi makes the machines that bond chip surfaces directly together, a market Bernstein expects it to dominate in 2028, and the Dutch company was the worst performer in the Stoxx 600 last quarter before Bank of America halved its price target
Via TNW | Artificial-intelligence
Bank of America cut BE Semiconductor Industries to neutral and nearly halved its price target, saying the share price does not reflect the threat of ASML entering hybrid bonding, the market Besi depends on for growth. Besi has also been approached by two American rivals, one of which has owned 9% of it since last year.
Bank of America has cut BE Semiconductor Industries to neutral and nearly halved its price target, because another Dutch company might enter its market…
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