Nvidia reportedly wants all its HBM suppliers to use TSMC’s 3nm process

Samsung Electronics will make a core part of Nvidia’s custom memory chips on TSMC’s 3-nanometre process. The Seoul Economic Daily reported the move on Sunday, citing industry sources. It would be the first time the two have worked together on making high-bandwidth memory (HBM).

The part is the base die, the logic layer at the bottom of an HBM stack. Until now, Samsung has made both the base die and the memory dies above it for all of its HBM…